Plasma Exposure Behavior of Yttrium Oxide Film Formed by Aerosol Deposition Method
| Autor: | Masakatsu Kiyohara, Hiroaki Ashizawa |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Plasma etching Metallurgy technology industry and agriculture 02 engineering and technology Plasma Substrate (electronics) 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Etching (microfabrication) 0103 physical sciences Surface roughness Dry etching Electrical and Electronic Engineering Reactive-ion etching Composite material 0210 nano-technology Plasma processing |
| Zdroj: | IEEE Transactions on Semiconductor Manufacturing. 30:357-361 |
| ISSN: | 1558-2345 0894-6507 |
| DOI: | 10.1109/tsm.2017.2752752 |
| Popis: | Aerosol deposition (AD) method is technique for forming high density ceramic films on substrate material surface at room temperature. The yttrium oxide films formed by the AD method (AD-Y2O3 films) have been developed as plasma resistance coating used for the plasma etching equipment. In recent years, plasma eroded particles from chamber components of the etching devices are regarded as a serious issue that they reduce the semiconductor device yield rate. AD-Y2O3 films which have excellent plasma resistance can reduce the eroded particles in the plasma etching equipment and greatly have contributed to manufacturing high integrated semiconductor devices. In this paper, the plasma erosion behavior of AD-Y2O3 films were investigated compared with sintered Al2O3, sintered Y2O3 and thermal splayed Y2O3 in order to clarify the reason why AD Y2O3 films were superior as plasma resistance material. The plasma etching rates of AD-Y2O3 films were not significantly different from other samples. It was assumed that the etching rates were dependent on the chemical stability to fluorine plasma of material. On the other hand, the surface roughness difference before and after plasma exposure of AD-Y2O3 films were much smaller than other samples. It was assumed that the surface roughness difference is dependent on the crystalline size of material. The structure of AD-Y2O3 films, which had high density and nano-crystalline structure, were eroded homogeneously and smoothly. It suggests AD-Y2O3 films do not generate large eroded particles and are superior to reduce the eroded particles in the etching devices. |
| Databáze: | OpenAIRE |
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