High power LED package with vertical structure
| Autor: | Kuang Yu Tai, Ming Te Lin, Jyh Chen Chen, Ming-Yao Lin, Shang Ping Ying |
|---|---|
| Rok vydání: | 2012 |
| Předmět: |
Materials science
Fabrication business.industry Thermal resistance Edison screw Semiconductor device Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Power (physics) law.invention Reliability (semiconductor) law Thermal Optoelectronics Electrical and Electronic Engineering Safety Risk Reliability and Quality business Light-emitting diode |
| Zdroj: | Microelectronics Reliability. 52:878-883 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2011.07.064 |
| Popis: | A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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