Analytical study of polymer deposition distribution for two-dimensional trench sidewall in low-k fluorocarbon plasma etching process

Autor: Minwoo Ha, Gwang Sik Kim, Sun Woo Kim, Hwan Jun Zang, Choon Hwan Kim, Hyun Yong Yu, June Park, Kyung-Bo Ko, Sang-Soo Park
Rok vydání: 2018
Předmět:
Zdroj: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 36:011802
ISSN: 2166-2754
2166-2746
DOI: 10.1116/1.4996641
Popis: In this study, a new polymer deposition distribution model for a two-dimensional low-k porous SiOCH trench structure during the fluorocarbon plasma etching process is described so as to investigate the bowing effect in a nanoscale trench. The model consists of three processes, namely, (1) polymer reflection, (2) ion-assisted polymer deposition, and (3) ion-assisted polymer emission. To calculate the distribution of the polymer, the polymer flux arrived at the surface points of the trench was calculated based on the model. To estimate the profile of the trench, the flux of the etchants at the point of the trench surface was also considered. The simulated etching process is based on a simple flux model, which takes into account angular distributions for ions and radicals from the sheath edge to the trench. Simulation results show that the lower section of the sidewall had a larger number of polymer particles than the other positions of the sidewall did. According to the simulated results, the sidewall bowin...
Databáze: OpenAIRE