The Study of the Cycle Time Improvement by Work‐In‐Process Statistical Process Control Method for IC Foundry Manufacturing

Autor: Yu‐Cheng Lin, Chih-Hung Tsai, Rong-Kwei Li, Hsien‐Ching Chen, Ching‐Piao Chen
Rok vydání: 2008
Předmět:
Zdroj: Asian Journal on Quality. 9:71-91
ISSN: 1598-2688
DOI: 10.1108/15982688200800028
Popis: The definition of cycle time is the time from the wafer start to the wafer output. It usually takes one or two months to get the product since customer decides to produce it. The cycle time is a critical factor for customer satisfaction because it represents the response time to the market. Long cycle time reflects the ineffective investment for the capital. The cycle time is very important for foundry because long cycle time will cause customer unsatisfied and the order loss. Consequently, all of the foundries put lots of human source in the cycle time improvement. Usually, we make decisions based on the experience in the cycle time management. We have no mechanism or theory for cycle time management. We do work‐in‐process (WIP) management based on turn rate and standard WIP (STD WIP) set by experiences. But the experience didn’t mean the optimal solution, when the situation changed, the cycle time or the standard WIP will also be changed. The experience will not always be applicable. If we only have the experience and no mechanism, management will not be work out. After interview several foundry fab managers, all of the fab can’t reflect the situation. That is, all of them will have an impact period after product mix or utilization varied. In this study, we want to develop a formula for standard WIP and use statistical process control (SPC) concept to set WIP upper/lower limit level. When WIP exceed the limit level, it will trigger action plans to compensate WIP Profile. If WIP Profile balances, we don’t need too much WIP. So WIP level could be reduced and cycle time also could be reduced.
Databáze: OpenAIRE