Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications

Autor:	V. Larrey, A. Jouve, Frank Fournel, Karim Hassan, Bertrand Szelag, Loic Sanchez, G. Mauguen, Severine Cheramy, L. Bally, M. Laugier, François Rieutord, Emmanuel Rolland, C. Castan, B. Montmayeul, L. Adelimini, Christophe Morales
Rok vydání:	2019
Předmět:	Materials science Silicon business.industry Wafer bonding chemistry.chemical_element Direct bonding Die (integrated circuit) chemistry.chemical_compound chemistry Indium phosphide Optoelectronics Wafer Photonics business
Zdroj:	2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
DOI:	10.23919/ltb-3d.2019.8735248
Popis:	Direct wafer bonding of wafers is now well establish. However in many interesting applications, direct bonding of die to wafer can lead to innovative devices. After explaining some specific fundamental mechanisms, III/V die to wafer bonding and copper hybrid bonding will be presented for photonic and 3D applications.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0fbcd67e3c45e989eabf98e6049476e3 https://doi.org/10.23919/ltb-3d.2019.8735248 Zobrazit plný text záznamu