Research of Control and Scheduling for Die-Bonding
Autor: | Guangjun Liao |
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Rok vydání: | 2010 |
Předmět: | |
Zdroj: | 2010 Second WRI Global Congress on Intelligent Systems. |
DOI: | 10.1109/gcis.2010.152 |
Popis: | Die-bonding is a necessary machine in semiconductor production line. In the thesis, the control and scheduling for the machine is focused on. Firstly, analyzing atypical task-scheduling algorithm in single-processor real-time system and introducing the work flow. Secondly, giving the software framework based on thread-pool for the control platform. Finally, discussing motion control module and triode-wafer detection module in detail. |
Databáze: | OpenAIRE |
Externí odkaz: |