Diffusion Bonding of Silicon Nitride with Low Carbon Steel Using Tungsten Layer

Autor:	N. Bhieh, W. Wlosinski
Rok vydání:	1993
Předmět:	Materials science Carbon steel Mechanical Engineering Metallurgy chemistry.chemical_element Nitride Tungsten engineering.material chemistry.chemical_compound Silicon nitride chemistry Mechanics of Materials Silicide engineering General Materials Science Layer (electronics) Diffusion bonding
Zdroj:	Key Engineering Materials. :743-748
ISSN:	1662-9795
DOI:	10.4028/www.scientific.net/kem.89-91.743
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0ef39599c69942fddaec2c44c40b60ea https://doi.org/10.4028/www.scientific.net/kem.89-91.743 Zobrazit plný text záznamu