| Autor: |
Zheng-Jun Hu, Shou-Mian Chen, Hong Shi, Wen-Qiang Li, Wen-Fang Qin |
| Rok vydání: |
2006 |
| Předmět: |
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| Zdroj: |
2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings. |
| DOI: |
10.1109/icsict.2006.306248 |
| Popis: |
Full factorial design (2 level) is used to study the F% influenced by the different process parameters, gas flow, power etc. X-SEM study on gap-filling and metal top line clipping (metal clipping) is also performed. High temperature vacuum baking is used to study the fluorinated-silicate-glass (FSG) film stability. Dielectric constant of bulk FSG with different F% is extracted by MIS structure |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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