| Autor: |
N.Ph. Lukina, K.L. Besednov, A.Yu. Isaev, A.P. Petrova |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
Proceedings of VIAM. :64-77 |
| ISSN: |
2307-6046 |
| DOI: |
10.18577/2307-6046-2021-0-5-64-77 |
| Popis: |
Data on the use of various types of silver filler in electrically conductive adhesive compositions are presented. The influence of form and size particles of silver filler on the conductive properties of adhesive bondline. The effect of surface treatment of conductive particles with surfactants, the component composition of the resin part and the curing conditions of conductive adhesive compositions on their microstructure and conductive properties is shown. An overview of the results of studies of the microstructure of conductive silver-containing adhesive compositions is given. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
