Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
| Autor: | Frank Libsch, Hiroyuki Mori, Xiaoxiong Gu |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
| Databáze: | OpenAIRE |
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