| Autor: |
J.P. Laine, R. Cathala, K. Abouda, Patrice Besse, Matthieu Deloge |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo). |
| DOI: |
10.1109/emccompo.2019.8919869 |
| Popis: |
Integrated circuits such as automotive transceivers require very high EMC and ESD performance within a minimum footprint. This paper illustrates the study of an integrated LIN transceiver and the optimization of collateral effects between ESD and EMC solutions. Interaction between the circuitry and the ESD clamp is detailed in this paper. Simulation, theory and silicon results are presented from the first silicon failing DPI tests to the finial version which is fully compliant with automotive EMC and ESD requirements. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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