Negative ions for heavy ion fusion and semiconductor manufacturing applications
Autor: | S. K. Hahto, V. Benveniste, K. Saadatmand, S.T. Hahto, L. R. Grisham, Ka-Ngo Leung, J.W. Kwan |
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Rok vydání: | 2004 |
Předmět: | |
Zdroj: | Review of Scientific Instruments. 75:1799-1802 |
ISSN: | 1089-7623 0034-6748 |
DOI: | 10.1063/1.1699455 |
Popis: | Radio frequency driven multicusp source was set up to run chlorine plasma and the source performance was compared between positive and negative chlorine ion production. A maximum Cl− current density of 45 mA/cm2 was achieved at 2.2 kW of rf power with electron to negative ion ratio of 7 and positive to negative ion ratio of 1.3. 99.8% of the total negative chlorine beam was atomic Cl−. To produce negative boron ions for semiconductor manufacturing applications, a noncesiated, sputtering-type surface production ion source was constructed. An external rf antenna geometry and large LaB6 converter were implemented in the source design. Maximum B2− ion current density of 1 mA/cm2 was achieved at 800 W of rf power and −600 V converter voltage. Total B2− ion current was 1.8 mA. |
Databáze: | OpenAIRE |
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