Pool boiling heat transfer enhancement and bubble visualization on a microporous copper over CuO filmed surface through combination of chemical etching and electrochemical deposition
| Autor: | Sanjib Kalita, Dipak Sen, Pulak Sen, Sudev Das, Bidyut Baran Saha |
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| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | International Communications in Heat and Mass Transfer. 144:106740 |
| ISSN: | 0735-1933 |
| DOI: | 10.1016/j.icheatmasstransfer.2023.106740 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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