| Popis: |
Aiming at the problems of low cleaning efficiency and poor cleaning effect of the current wet cleaning device for wafers, a multi-chip rotary cleaning equipment was designed, which used cleaning manipulator instead of human hands to achieve automatic cleaning. First, the equipment cleaning system and cleaning principle were explained. Then, the mechanical structure of the multi-chip rotary cleaning equipment was specifically designed, and the kinematics equation of the cleaning manipulator was established. Next, the modal analysis of the supporting structure and the dynamic simulation analysis of the manipulator were carried out. The analysis results showed that this cleaning manipulator could meet the requirements of trajectory output and the strength. Finally, the cleaning effect was verified through comparative experiments, and the experimentals result showed that the corrosion depth of the wafer met the process requirements. This wafer cleaning equipment has the advantages of high automation, simple and reliable structure, high cleaning efficiency and good effect, which has reference significance for the research of wafer cleaning equipment. |
