Laboratory scale investigation into the corrosion of copper in a sulphur-containing environment

Autor:	Bongephiwe Mpilonhle Thethwayo, A. M. Garbers-Craig
Rok vydání:	2011
Předmět:	Materials science General Chemical Engineering Inorganic chemistry chemistry.chemical_element General Chemistry Laboratory scale Hydrogen sulphide Sulfur Copper Corrosion chemistry Copper foil General Materials Science Gas composition Anaerobic corrosion
Zdroj:	Corrosion Science. 53:3068-3074
ISSN:	0010-938X
Popis:	The effect of temperature and gas composition on the corrosion rate and corrosion by-product of copper foil was studied by exposing it to sulphur (S2), S2 + hydrochloric acid (HCl) and hydrogen sulphide. The temperature was varied from 80 to 140 °C. Copper foil reacted with S2 to form CuS, Cu9S8 and Cu1.8S. Corrosion rates ranged from 9.6 μm/h at 110 °C to 0.5 μm/h at 140 °C. The presence of HCl caused pitting and enhanced the corrosion rate above 112 °C. Cu2S formed when copper was exposed to hydrogen sulphide gas. Sulphide scale that formed was friable and non-adherent.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0d864c42b1d56e6084517e2fe11a5f0f https://doi.org/10.1016/j.corsci.2011.05.016 Zobrazit plný text záznamu Full Text from ScienceDirect