Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints

Autor:	Rebecca Wheeling, Paul Vianco, Shelley Williams, Luis Jauregui, Dorina F. Sava Gallis
Rok vydání:	2022
Předmět:	Materials Chemistry Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Materials. 51:7337-7352
ISSN:	1543-186X 0361-5235
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0d7e10d0b2a3c9dada7b44137cfa496e https://doi.org/10.1007/s11664-022-09891-2 Zobrazit plný text záznamu Full text from SpringerLink