| Autor: |
Won-Kyoung Choi, Cheng Xu, Zhaowei Zhong |
| Rok vydání: |
2019 |
| Předmět: |
|
| Zdroj: |
2019 China Semiconductor Technology International Conference (CSTIC). |
| DOI: |
10.1109/cstic.2019.8755687 |
| Popis: |
In our previous studies, we have found that the over-molded structure FOWLP always shows the highest flexure strength. In the work of this paper, we would find out additional factors that affect the FOWLP strength. Two factors investigated are the silicon die to package ratio, and the package size. We find that the flexure strength decreases when the silicon die size increases. The smaller over-molded structure FOWLP has higher flexure strength. The reasons for these are analyzed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
