Crack Identification in BEoL Stacks Using Acoustic Emission Testing and Nano X-ray Computed Tomography
| Autor: | Ehrenfried Zschech, Jendrik Silomon, André Clausner, Jens Paul, Jürgen Gluch |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Thermal copper pillar bump Shearing (physics) Materials science business.industry 02 engineering and technology Semiconductor device Acoustic wave 021001 nanoscience & nanotechnology 01 natural sciences Back end of line Stack (abstract data type) Acoustic emission Temporal resolution 0103 physical sciences Optoelectronics 0210 nano-technology business |
| Zdroj: | 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| DOI: | 10.1109/ipfa49335.2020.9260701 |
| Popis: | A novel approach is presented to evaluate the mechanical stability of back end of line (BEoL) stacks. A SRAM test vehicle manufactured in 28 nm technology with copper pillar bumps is used. To inflict damage to the BEoL of the given semiconductor device, external forces are applied to the copper pillars by shear loading using a tribo-indenter system. An acoustic emission (AE) detection sensor is attached to the sample to measure acoustic waves during the shear experiment as an indication for damage. The damage progression in the BEoL stack is extremely fast, hence details can't be resolved with the piezo sensors of the tribo-indenter anymore. However, due to the much higher temporal resolution AE measurements give a more precise insight into the damage process. The resulting damages are imaged using nano X-ray computed tomography (nXCT) as well as scanning electron microscopy (SEM). The results provide a better understanding of the origin and the propagation of damages in the BEoL stack. |
| Databáze: | OpenAIRE |
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