| Popis: |
Moisture is a key culprit in degrading adhesive bonds. This chapter reviews recent developments in test methods and techniques that have been used to assess and understand the role moisture plays in bond degradation, placing emphasis on accelerated destructive aging and testing, as well as non-destructive evaluation. Current understanding of interfacial water accumulation and advances in techniques for quantifying interfacial water distribution and diffusion are discussed. Finally, progress in surface pretreatment techniques, modification of bulk properties, engineering of novel biological adhesives and joint design considerations for improving adhesive bonds in wet conditions are presented. |
