| Autor: |
Rao Tummala, Srikrishna Sitaraman, Junki Min, Bruce C. Chou, Christian Nopper, Motoshi Ono, Yoichiro Sato, Franck Dosseul, Madhavan Swaminathan, Venky Sundaram, Vijay Sukumaran, Choukri Karoui |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
2013 IEEE 63rd Electronic Components and Technology Conference. |
| DOI: |
10.1109/ectc.2013.6575795 |
| Popis: |
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100 μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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