Metal adhesive properties of polyamides having the 2,3-bis(1,4-phenylene)quinoxalinediyl structure

Autor: Tomokazu Inagawa, Yusuke Sonoda, Yoshio Kasashima, Kenji Marushima, Fumihiko Akutsu, Mari Inoki
Rok vydání: 1999
Předmět:
Zdroj: Journal of Applied Polymer Science. 74:1366-1370
ISSN: 1097-4628
0021-8995
DOI: 10.1002/(sici)1097-4628(19991107)74:6<1366::aid-app7>3.0.co;2-c
Popis: Polyamides were synthesized by interfacial polycondensation of 2,3-bis(4-chloroformylphenyl)quinoxaline (BCFPQ) and several aliphatic diamines using a phase transfer catalyst, and their adhesive property for stainless steel was investigated. The inherent viscosity of the obtained polyamides ranged from 0.37 to 1.24 dL g−1. The glass transition temperatures of the polyamides ranged between 154 and 201°C, and their thermal decomposition temperatures were above 450°C. The polyamides were soluble in several organic solvents, including m-cresol, N-methyl-2-pyrrolidone (NMP), and formic acid. The adhesive property for stainless steel was examined by a standard tensile test. One member of the series, polyamide P8, derived from BCFPQ and 1,8-octanediamine, displayed high tensile strength with values of 232 kgf cm−2 at 20°C, 173 kgf cm−2 at 120°C, and 137 kgf cm−2 at 180°C. Thus, the tensile strength of P8 decreased at 180°C, but the decrease was much smaller than that of an epoxy resin in wide use as a metal adhesive. Heat distortion temperature, measured by thermal mechanical analysis, of P8 was 191°C. This suggested that P8 possessed high thermal resistance in metal adhesives. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1366–1370, 1999
Databáze: OpenAIRE
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