| Popis: |
A brief introduction to reliability issues that could limit scaling is presented. Traditional reliability testing is reviewed, together with the standard methods for analyzing the data. Arguments are presented to justify that a modern view of reliability has to include a broader set of concerns, including security and software reliability. The wear-out curve, showing infant mortality, ware-out, and end of life, are described. The main failure mechanisms in devices—the various leakages in the device and in the device-gates—are reviewed; gate oxide reliability is summarized. For the back-end, the dilemma of the interconnect delay not keeping up with the gate delay decrease implies difficulties in further scaling and this is discussed. Other failure mechanisms such as electromigration, metal extrusion, and whisker growth are reviewed. The chapter ends with a brief discussion on the mathematics of reliability. |
