Sip Solder Paste with Superior Slump Resistance via Powder Cluster Mechanism

Autor:	Zhengfeng Xu, Aixia Zheng, Jian Wang, Ming Wang, Ning-Cheng Lee
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
DOI:	10.1109/icept56209.2022.9873236
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0bc768649af28508872bd0e456698768 https://doi.org/10.1109/icept56209.2022.9873236 Zobrazit plný text záznamu