Use of organosilicon compounds as modifiers of epoxy compositions

Autor:	R. M. Garipov, O. V. Stoyanov, M. V. Kolpakova, A. A. Efremov, A. I. Zagidullin
Rok vydání:	2008
Předmět:	Materials science Polymers and Plastics Bisphenol General Chemical Engineering General Chemistry Epoxy Adhesion chemistry.chemical_compound chemistry visual_art Polymer chemistry visual_art.visual_art_medium Organic chemistry Amine gas treating Thermal stability Organosilicon
Zdroj:	Polymer Science. Series D. 1:244-248
ISSN:	1995-4220 1995-4212
DOI:	10.1134/s1995421208040060
Popis:	Organosilicon compounds used to improve the strength and adhesion properties, as well as the thermal stability, of epoxy compositions are reviewed. Properties of composition on the basis of bisphenol A-based ED-20 resin cured with a KrOOT-1 silicon-containing amine are described.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0b96a9515e0105a8783673574db1a230 https://doi.org/10.1134/s1995421208040060 Zobrazit plný text záznamu Full text from SpringerLink