Reliability Improvement of Large BGA-Packages Using Sidefill Support

Autor:	Manuel Heine, Karsten Meier, Laura Wambera, Karlheinz Bock, Christian Gotze
Rok vydání:	2022
Zdroj:	2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
DOI:	10.1109/estc55720.2022.9939434
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0b8b8f396a67e56dad82593b46aff43f https://doi.org/10.1109/estc55720.2022.9939434 Zobrazit plný text záznamu