Printed circuit board process based thermopile-type heat flux sensor used for monitoring chips

Autor:	D.H. Wang, M.Z. Wang, Y.H. Peng, Y. Zhang
Rok vydání:	2022
Předmět:	Energy Engineering and Power Technology Industrial and Manufacturing Engineering
Zdroj:	Applied Thermal Engineering. 205:117860
ISSN:	1359-4311
DOI:	10.1016/j.applthermaleng.2021.117860
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0b71266dcb4d30df86b68b27092c18dd https://doi.org/10.1016/j.applthermaleng.2021.117860 Zobrazit plný text záznamu Full Text from ScienceDirect