Adhesion and fracture of tantalum nitride films
| Autor: | D.P. Norwood, S. Venka-taraman, N.R. Mody, J.E. Angelo, Robert Q. Hwang, W.W. Gerberich |
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| Rok vydání: | 1998 |
| Předmět: |
Materials science
Polymers and Plastics Metals and Alloys Microstructure Electronic Optical and Magnetic Materials chemistry.chemical_compound Compressive strength Tantalum nitride chemistry Residual stress Indentation Physical vapor deposition Ceramics and Composites Fracture (geology) Forensic engineering Thin film Composite material |
| Zdroj: | Acta Materialia. 46:585-597 |
| ISSN: | 1359-6454 |
| DOI: | 10.1016/s1359-6454(97)00243-7 |
| Popis: | Indentation fracture and continuous nanoscratch testing were used in this study to determine the effects of compressive residual stresses on the fracture of thin sputter-deposited tantalum nitride films. Some films were tested in the as-deposited condition while others were vacuum annealed at 300 C. The only discernible change in structure was a surface rearrangement of atoms into parallel arrays of striations on the vacuum annealed samples revealing a high compressive residual stress state after deposition. Comparison of results and application of mechanics-based models showed that these stresses had a strong effect on the fracture of the as-deposited films. The models also provided a good measure of the residual stress levels and interfacial strain energy release rates. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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