In–Bi low-temperature SLID bonding for piezoelectric materials
| Autor: | Trym Eggen, Hoang-Vu Nguyen, Tung Manh, Knut E. Aasmundtveit |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Intermetallic 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Lead zirconate titanate 01 natural sciences Piezoelectricity chemistry.chemical_compound chemistry Soldering 0103 physical sciences General Materials Science Electrical and Electronic Engineering Thin film Composite material 0210 nano-technology Polarization (electrochemistry) Layer (electronics) Eutectic system |
| Zdroj: | Soldering & Surface Mount Technology. 30:100-105 |
| ISSN: | 0954-0911 |
| DOI: | 10.1108/ssmt-10-2017-0034 |
| Popis: | Purpose This paper aims to demonstrate low-temperature bonding for piezoelectric materials at temperatures well below the relevant Curie temperatures so as to avoid depolarization of the piezoelectric material during bonding. Design/methodology/approach Au-coated test samples of lead zirconate titanate (PZT) are bonded to a WC-based resonant backing layer with In–Bi eutectic material in which the In–Bi metal system is a preform or thin, evaporated layers. The bonded samples are characterized using electrical impedance spectroscopy and cross-section microscopy. The first technique verifies the integrity of polarization and reveals the quality of the bondline in a non-destructive manner, particularly looking for voids and delaminations. The latter technique is destructive but gives more precise information and an overview of the structure. Findings Successful low-temperature (115°C) bonding with intact PZT polarization was demonstrated. The bondlines show a layered structure of Au/Au–In intermetallic compounds (with Bi inclusions)/Au, capable of withstanding temperatures as high as 271°C before remelting occurs. For bonded samples using In–Bi preform, repeatable bonds of high quality (very little voiding) were obtained, but the bonding time is long (1 h or more). For bonded samples using evaporated thin films of In–Bi, bonding can be performed in 30 min, but the process needs further optimization to be repeatable. Originality/value Low-temperature solid-liquid interdiffusion (SLID) bonding is a novel technique, merging the fields of low-temperature solder bonding with the SLID/transient liquid phase (TLP) approach, which is normally used for much higher temperatures. |
| Databáze: | OpenAIRE |
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