Optimum design of a large area, flexure based XYθ mask alignment stage for a 12-inch wafer using grey relation analysis
Autor: | Je Hoon Oh, Sang-Gil Ryu, Jae Woong Lee, Chang Kyu Lee |
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Rok vydání: | 2019 |
Předmět: |
0209 industrial biotechnology
Materials science business.industry General Mathematics 020208 electrical & electronic engineering Natural frequency 02 engineering and technology Structural engineering Industrial and Manufacturing Engineering Finite element method Computer Science Applications law.invention 020901 industrial engineering & automation Electrical discharge machining Control and Systems Engineering Deflection (engineering) law 0202 electrical engineering electronic engineering information engineering Wafer Photolithography Orthogonal array business Actuator Software |
Zdroj: | Robotics and Computer-Integrated Manufacturing. 58:109-119 |
ISSN: | 0736-5845 |
DOI: | 10.1016/j.rcim.2019.02.005 |
Popis: | An optimum design methodology for a large area, flexure-based XYθ mask alignment stage, which can be applied to a 12-inch wafer photolithography process, was presented. The XYθ micropositioning stage consisted of a working plate with a 12-inch hole in the center, three piezo actuators, and three displacement amplifiers based on the bridge-type flexure mechanism. Grey relation analysis and orthogonal array were incorporated with finite element analysis to find optimum design conditions. The grey relation grade with weight factors was used to simultaneously optimize three objective characteristics of the micropositioning stage: the maximum stroke, deflection of the working plate, and first natural frequency. The optimally-designed stage was fabricated by wire electrical discharge machining and tested to investigate its performance. The proposed stage showed the first natural frequency of 57 Hz and the maximum stroke of 122.84 μm, 108.46 μm, 0.685 mrad in the x-, y-, and θ-direction, respectively. The resolutions in corresponding directions were 11 nm, 10 nm, and 0.5 μrad. The performance of the stage was improved by optimum design process, and the experimental results were in good agreement with the predicted ones from the finite element analysis. |
Databáze: | OpenAIRE |
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