Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
| Autor: | Jen-Hsiang Liu, Jenn-Ming Song, Wei-Chen Huang, Chin-Huang Chang, Chi-Lin Huang, Lung-Tang Hung, Shih-Chieh Chao, Po-Yen Shen |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
Oxide chemistry.chemical_element 02 engineering and technology 01 natural sciences Lead frame chemistry.chemical_compound 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Surface roughness Electrical and Electronic Engineering Fourier transform infrared spectroscopy Composite material Safety Risk Reliability and Quality Electroplating 010302 applied physics 020208 electrical & electronic engineering Epoxy Condensed Matter Physics Copper Atomic and Molecular Physics and Optics Surface energy Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry visual_art visual_art.visual_art_medium |
| Zdroj: | Microelectronics Reliability. 99:161-167 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2019.05.020 |
| Popis: | This study investigates surface oxidized layers of Cu-Fe-Zn-P (C194) and Cu-Ni-Si-Mg (C7025) lead frames under different oxidation conditions and their influence on the adhesion of epoxy molding compounds with lead frames. Micro-etching and electroplating are adopted to roughen the surface. Isothermal heat treatments which simulate molding and curing processes, as well as high temperature aging, are carried out to oxidize lead frame surface. According to the absorption peaks of FTIR (Fourier transform infrared spectroscopy) spectra, the topmost surface of the oxide layer can be easily identified. In combination with the reduction potential and time obtained from the coulometric reduction test, the variation of oxide phases along the through-thickness direction can also be revealed. Experimental results show that in addition to surface roughness, surface oxides and their thickness play more important roles in the interfacial strength between lead frames and epoxy molding compounds. In the case of the surface with one single Cu2O layer, an increase in oxide layer results in a decrease in bonding strength. Once the topmost surface forms CuO, the bonding strength could be enhanced due to a greater surface energy. Compared with electroplated C194, the thinner surface oxide layer and thus better performance in adhesion strength for electroplated C7025 can be ascribed to the immersion Ag surface treatment. |
| Databáze: | OpenAIRE |
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