Influence of Ag Layer on Microstructural Evolution and Joining Properties With Zn Foil for Power Electronics
| Autor: | Yidian Shi, Wenhui Zhu, Liancheng Wang |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Kirkendall effect Intermetallic 02 engineering and technology Nanoindentation 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Soldering 0103 physical sciences Shear strength Electrical and Electronic Engineering Composite material 0210 nano-technology FOIL method Diffusion bonding |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:1266-1275 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2020.3007170 |
| Popis: | Solid diffusion bonding of the copper–zinc system is preliminarily investigated as a possible bonding solution for power modules. This article proposed a method of bonding Zn foil on substrate-plated Ag to obtain the solder joints. The formation and transformation of intermetallic compounds (IMCs) in Cu–Zn and Ag–Zn joints were investigated. The results showed that the AgZn3 phase was compressed and moved into the solder side when competed with the Cu5Zn8 phase, relieved the Kirkendall voids, and enhanced the connection of joints. Besides, the electrical resistivity could maintain at a competitive level of $9~\mu \Omega \cdot {\mathrm {cm}} $ , and the shear strength reached 43–75 MPa. These properties were also appreciated even after the aging test. The deformation behaviors of different IMCs were tested by nanoindentation. This work provides a potential alternative to high-temperature solders used for high-power-density electronic packaging applications. |
| Databáze: | OpenAIRE |
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