| Autor: |
Lin Zhu, Nuo Bao, Chun Jie Wang, Shun Guang Song |
| Rok vydání: |
2012 |
| Předmět: |
|
| Zdroj: |
Applied Mechanics and Materials. 163:34-38 |
| ISSN: |
1662-7482 |
| DOI: |
10.4028/www.scientific.net/amm.163.34 |
| Popis: |
In order to obtain a better filling way with suitable adhesive to enhance the reliability of 3D PLUS solder joints. Finite element analysis of random vibration method was carried out. By means of the method, the effect of filling way on the stress distribution in solder joints was investigated under the condition of two types adhesives 55/9 and GD414. Stress distribution and its maximum value of 3D PLUS solder joint at peak time were acquired. Comparative analysis of the maximum stress between under filled adhesive and side filled adhesive with 55/9 or GD414 respectively. The results showed that under filled adhesive 55/9 can effectively improve the solder joint stress. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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