Silicon Oxide Barrier Films Deposited on Polycarbonate Substrates in Pulsed Plasmas
| Autor: | Marcel Rudolph, Lanti Yang, Shaham Shafaei, Peter Awakowicz |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Hexamethyldisiloxane Materials science Silicon General Chemical Engineering chemistry.chemical_element General Chemistry Surface finish Substrate (electronics) engineering.material Condensed Matter Physics 01 natural sciences 010305 fluids & plasmas Surfaces Coatings and Films chemistry.chemical_compound Coating chemistry Plasma-enhanced chemical vapor deposition 0103 physical sciences engineering Thin film Composite material Silicon oxide |
| Zdroj: | Plasma Chemistry and Plasma Processing. 40:607-623 |
| ISSN: | 1572-8986 0272-4324 |
| DOI: | 10.1007/s11090-019-10049-y |
| Popis: | For many applications of polycarbonate (PC) from packaging to micro-electronics improved barrier properties are necessary. In this contribution, silica thin films were deposited from hexamethyldisiloxane/oxygen (HMDSO/O2) on polycarbonate substrate in three step plasma processes by combining a microwave (MW) surface wave discharge of 2.45 GHz with an optional radio-frequency (RF) bias of 13.56 MHz. The influence of interlayer thickness, HMDSO flow and oxygen to HMDSO ratio on barrier performance for three step-coating processes was investigated. The morphology and surface properties of the coated surface of PC were studied by atomic force microscopy (AFM). The surface topography showed a silica particles distribution on the PC substrate with relatively smooth surface roughness. AFM-QNM provides more insight into the surface morphology and stiffness. The results identify the coating structure for PC film coated with and without bias. High barrier improvement of the deposited films on PC substrates was obtained after plasma silicon coating process with a barrier improvement factor up to 337. It was found that the deposition process is optimal for food packaging applications by using combined MW-RF PECVD technology. |
| Databáze: | OpenAIRE |
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