SOI Wafer Thin - Backgrind and Assembly Capability
| Autor: | BW Tan, SH Liew, Robin Wu, HK Phang, B. M. Chan, K. F. Chung, PN Ng |
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| Rok vydání: | 2012 |
| Předmět: | |
| Zdroj: | ECS Transactions. 44:957-967 |
| ISSN: | 1938-6737 1938-5862 |
| DOI: | 10.1149/1.3694417 |
| Popis: | The evolvement in semiconductor technology is on fast-track with difficult challenges in the continuous drive in seeking for technology breakthrough. Hence, the electronic designers are racing to invent innovative applications via powerful electronic devices that serve to ease today's aggressiveness in technology advances. By inventing greater performance & powerful ICs steer into a wider market sectors such as 1.) Automotive segments & Heavy Industrial which need robust voltage isolation from an IC chip, 2.) Global Corporate Organizations that required distinctive speed and precise information to be disseminated seamlessly via the Super Computers that is embedded with faster device operation (speed/ powerful device) from an IC thus, not neglecting 3) Latest advance consumer mobile devices which are also the highest market commodities like Smart phone, Tablet devices, Notebooks, Play Stations (PS), Media players, etc. Higher performance device is needed in order to meet the above new technology requirement. |
| Databáze: | OpenAIRE |
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