| Autor: |
Torsten Hauck, Todd F. Miller, David Lin, I. Schmadlak, G. Li, Vladimir Kolchuzhin, Jan Mehner |
| Rok vydání: |
2009 |
| Předmět: |
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| Zdroj: |
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. |
| DOI: |
10.1109/sensor.2009.5285685 |
| Popis: |
The paper is focused on the influence of packaging technologies on the performance of inertial MEMS sensors. System simulations of MEMS are vital to evaluate and optimize the interplay of transducer cells with the sensor electronics. Special emphasis must be put on packaging aspects in order to assess the impact of environmental and operating conditions on functional parameters as capacitance offset or loss of sensitivity affected by thermal-mechanical stress or structural deformation. This article presents modern reduced order modeling technologies which extract fast and accurate behavioral models from a series of finite element runs which can directly be used in Matlab/Simulink or Verilog-A for system design. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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