A reliable die attach method for high power semiconductor lasers and optical amplifiers

Autor:	S.A. Merritt, S.H. Cho, Peter J. S. Heim, Mario Dagenais
Rok vydání:	2002
Předmět:	Optical amplifier Materials science business.industry Thermal resistance Heat sink Laser Die (integrated circuit) Semiconductor laser theory law.invention Semiconductor law Electronic engineering Optoelectronics business Diode
Zdroj:	1995 Proceedings. 45th Electronic Components and Technology Conference.
DOI:	10.1109/ectc.1995.515316
Popis:	We have developed a reliable, high yield, void-free method for soldering high power semiconductor laser diodes epitaxy-side down. We have consistently obtained absolute thermal resistances as low at 1.5/spl deg/C/Watt and specific thermal resistances of 4/spl middot/10/sup -3/ K/spl middot/cm/sup 2//Watt on oxygen-free high conductivity (OFHC) copper heatsinks. This method has very wide process margins (75/spl deg/C), exhibits excellent repeatability (4%), and is suitable for laser die attach to diamond submounts.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::0922a5d4190abdc14ee8e5e24b4c79d2 https://doi.org/10.1109/ectc.1995.515316 Zobrazit plný text záznamu