Removal of Macro Aluminum Defects on Wafer Backside
Autor: | Akshit Patel, Trevor Junquera, Kun Yu, Sridhar Kuchibhatla, Nirmal Sundaramoorthy, Harith Sethupathi, Samuel Marble, Casey Biederman, Brett Yatzor, Brian O'Hara, Justin Clements, Chris Torcedo, Marc Berardi, Elizabeth Sunkel, Daniel Costello, Tyler Reynolds, Michael Hatzistergos, Vincent Sih, Bradley Morgenfield, Olugbenga Famodu |
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Rok vydání: | 2023 |
Zdroj: | 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). |
Databáze: | OpenAIRE |
Externí odkaz: |