Autor: |
Kiran V. Chatty, Peilin Song, Mujahid Muhammad, Moyra K. McManus, Alan J. Weger, Robert J. Gauthier, Pia Naoko Sanda, Franco Stellari |
Rok vydání: |
2004 |
Předmět: |
|
Zdroj: |
ITC |
DOI: |
10.1109/test.2003.1270845 |
Popis: |
Backside light emission and electrical measurements were used to evaluate the susceptibility to latchup of externally cabled I/O pins for a 0.13 µm technology generation [1,2] test chip, which was designed in a flip-chip package. Case studies of several Inputs/Outputs (I/Os) are shown along with conclusions regarding layout and floorplanning to ensure the robustness to various types of latchup trigger events. |
Databáze: |
OpenAIRE |
Externí odkaz: |
|