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The complete SMD-mounting process is a complex superposition of a lot of influences. There are general material (SMD-components, printed boards, solder paste, printing stencil), geometrical (layout) and process (solder paste printer, assembling equipment and their setup) influences. The main goal is the maximization of the process capabilities of the analyzed process. The superposition cannot be described by a simply addition of random values. A Monte-Carlo-Simulation is an effective way, to solve such problems. The paper describes an applicable simulation system for such tasks. |
