| Popis: |
The ultimate success of low-temperature hybrid assembly in which high-Pb Sn-Ag-Cu ball grid array solder joints are assembled with a low melting temperature alloy will be determined by a range of thermodynamic, kinetic, and microstructure evolution effects that are now being elucidated. This paper reports on fundamental thermodynamic analyses, reaction kinetics experiments, and characterization of microstructure and composition redistribution as a function of alloy composition, processing sequence and conditions, and geometry. The mechanisms contributing to the individual processes will be discussed. |
