Synergistic Additive-Additive Interactions in the Copper Electroplating Process

Autor: Peter Broekmann, Alexandra Wirth, Marc Martin, Thomas Haag, Markus Hahn, Anja Wagner, Dieter Mayer, Qiang Huang, Brett Baker-O`Neal, Keith Kwietniak, James Kelly, Jeffrey Hedrick
Rok vydání: 2008
Zdroj: ECS Meeting Abstracts. :2503-2503
ISSN: 2151-2043
DOI: 10.1149/ma2008-02/38/2503
Popis: not Available.
Databáze: OpenAIRE