Preparation and Properties of Modified Boron Nitride/Epoxy Resin Thermal Conductive Composites
| Autor: | Hao Ran Zhou, Zhen Yuan, Chen Liu |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Materials science Mechanical Engineering 02 engineering and technology Epoxy 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Conductive composites chemistry.chemical_compound Thermal conductivity chemistry Mechanics of Materials Boron nitride visual_art 0103 physical sciences Thermal visual_art.visual_art_medium General Materials Science Thermal stability Composite material 0210 nano-technology |
| Zdroj: | Materials Science Forum. 1003:173-178 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.1003.173 |
| Popis: | Boron nitride (BN) was modified by silane coupling agent (KH560) and used as heat conductive filler to prepare the modified BN (BN560)/epoxy composite. The effect of the BN560 filler content on the thermal conductivity and thermal stability of the epoxy composite was studied. The results show that BN560 can be uniformly dispersed in the epoxy matrix by an ultrasonic disperser. The BN560 added can effectively improve the thermal conductivity of the epoxy composite. With the increase of BN560 content to 20 wt.%, the thermal conductivity of the composite increases accordingly to 0.27 W/(m·K), 50% higher than that of pure epoxy, and a heat conductive network is formed. The BN560 added can improve the thermal stability of the composite. With increasing BN560 content, the thermal decomposition temperature and glass transition temperature of the composite increase. The composite with the BN560 content of 20 wt.% has the weight loss of 10 wt.% at 395.12 °C and the glass transition temperature of 144.59 °C. |
| Databáze: | OpenAIRE |
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