Ecologically clean solder based on Sn–Ag–Cu

Autor: B. N. Perevezentsev, M. N. Krumaev
Rok vydání: 2011
Předmět:
Zdroj: Welding International. 25:531-533
ISSN: 1754-2138
0950-7116
DOI: 10.1080/09507116.2011.554256
Popis: A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged.
Databáze: OpenAIRE