Ecologically clean solder based on Sn–Ag–Cu
Autor: | B. N. Perevezentsev, M. N. Krumaev |
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Rok vydání: | 2011 |
Předmět: | |
Zdroj: | Welding International. 25:531-533 |
ISSN: | 1754-2138 0950-7116 |
DOI: | 10.1080/09507116.2011.554256 |
Popis: | A solder is developed, which does not contain harmful components such as lead and shows super performance properties, at the same time the processing behaviour of the solder remains unchanged. |
Databáze: | OpenAIRE |
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