| Autor: |
Yutaka Uematsu, Masahiro Toyama, Hitoshi Taniguchi |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). |
| DOI: |
10.1109/epeps47316.2019.193235 |
| Popis: |
As a technology for simulating power-delivery network (PDN) impedance of a system-in-package (SiP) structure, a method that uses a partial-element-equivalent-circuit (PEEC) model—whose mesh size is varied according to the hierarchy of the PDN—is proposed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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