Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
| Autor: | H. J. L. Bressers, J.H.J. Janssen, L.J. Ernst, Kaspar M. B. Jansen, Guoqi Zhang, Daoguo Yang |
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| Rok vydání: | 2007 |
| Předmět: |
Bulk modulus
Materials science Modulus Dynamic mechanical analysis Epoxy Condensed Matter Physics Atomic and Molecular Physics and Optics Thermal expansion Surfaces Coatings and Films Electronic Optical and Magnetic Materials Shear modulus Residual stress visual_art visual_art.visual_art_medium Electrical and Electronic Engineering Composite material Safety Risk Reliability and Quality Shrinkage |
| Zdroj: | Microelectronics Reliability. 47:233-239 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2006.09.031 |
| Popis: | In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. In order to minimize these stresses inorganic fillers are added. These fillers have several opposing effects on the residual stresses because they decrease the cure shrinkage and thermal contraction but increase the modulus below and above the glass transition temperature. In this paper an extensive study on the cure-dependent rubbery moduli of a series of silica spheres filled epoxy resins is carried out both experimentally and theoretically. Low frequency dynamic mechanical analysis (DMA) was used to measure the rubbery modulus build-up during cure. A model based on scaling analysis was applied to describe the evolution of the rubbery shear modulus. The effect of the filler percentage on the rubbery shear and bulk moduli as well as the coefficients of thermal expansion were measured and compared with models from the theory of particulate-filled composites. |
| Databáze: | OpenAIRE |
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