Sharper and Dipper Laser Beam Shaping for Super-Resolved Imaging in Silicon
Autor: | Zeev Zalevsky, Maor Tiferet, Moshe Sinvani |
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Rok vydání: | 2019 |
Předmět: | |
Zdroj: | Imaging and Applied Optics 2019 (COSI, IS, MATH, pcAOP). |
DOI: | 10.1364/cosi.2019.jth3d.6 |
Popis: | Enhanced laser beam shaping for super-resolved imaging in silicon is demonstrated by applying pico-seconds pulsed pump at 775nm having increased penetration-depth into the silicon (than pump at 532nm) and yielding sharper PSF due to reduced diffusion effect of the generated free-charge-carriers. |
Databáze: | OpenAIRE |
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