Sharper and Dipper Laser Beam Shaping for Super-Resolved Imaging in Silicon

Autor: Zeev Zalevsky, Maor Tiferet, Moshe Sinvani
Rok vydání: 2019
Předmět:
Zdroj: Imaging and Applied Optics 2019 (COSI, IS, MATH, pcAOP).
DOI: 10.1364/cosi.2019.jth3d.6
Popis: Enhanced laser beam shaping for super-resolved imaging in silicon is demonstrated by applying pico-seconds pulsed pump at 775nm having increased penetration-depth into the silicon (than pump at 532nm) and yielding sharper PSF due to reduced diffusion effect of the generated free-charge-carriers.
Databáze: OpenAIRE