Inkjet-/3D-/4D-Printed Perpetual Electronics and Modules: RF and mm-Wave Devices for 5G+, IoT, Smart Agriculture, and Smart Cities Applications
| Autor: | Ryan Bahr, Ajibayo Adeyeye, Xuanke He, Tong-Hong Lin, Bijan Tehrani, Aline Eid, Manos M. Tentzeris, Yepu Cui |
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| Rok vydání: | 2020 |
| Předmět: |
Rapid prototyping
Radiation Iterative design Computer science business.industry Electrical engineering Intelligent decision support system 020206 networking & telecommunications 02 engineering and technology Condensed Matter Physics Network topology 0202 electrical engineering electronic engineering information engineering Wireless Electronics Electrical and Electronic Engineering business Lithography 5G |
| Zdroj: | IEEE Microwave Magazine. 21:87-103 |
| ISSN: | 1557-9581 1527-3342 |
| DOI: | 10.1109/mmm.2020.3023310 |
| Popis: | With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet of Things (IoT) technologies and the billion devices promised to be implemented by the end of the decade, the realization of inexpensive, low-power, and intelligent systems is highly desirable. Additive manufacturing (AM) is a technology seeing widespread adoption due to its ability to enable rapid prototyping for iterative design; its reduced setup costs, facilitating economic small-batch production; and its ability to significantly reduce waste by-products, resulting in both environmental benefits as well as lower manufacturing costs. On the other hand, current lithography-based manufacturing technologies-a huge contributor to the growing RF and 5G wireless electronics industry-require extensive design verification, have longer turnaround times, and produce harmful byproducts. Although AM can offer time and cost benefits under the correct conditions, among the more impactful demonstrations of the manufacturing technology are the novel topologies enabled by design rules that allow feature sets, including nonorthogonal planes, conformal surfaces, multimaterial deposition, simultaneous thick- and thin-film deposition [1], complex 3D structures, integrated voids, and gradient index materials. |
| Databáze: | OpenAIRE |
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