Evaluation of Via Shielding on Parasitic Coupling, Cavity-Resonance Modes, and Radiation in Multilayer Packages
| Autor: | Radosvet G. Arnaudov |
|---|---|
| Rok vydání: | 2009 |
| Předmět: |
Electromagnetic field
Engineering Computer Networks and Communications business.industry Frequency band Acoustics Effective radiated power Electromagnetic interference Electronic Optical and Magnetic Materials Electromagnetic shielding Electronic engineering Electrical and Electronic Engineering Propagation constant business Microwave Noise (radio) |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 6:172-181 |
| ISSN: | 1551-4897 |
| DOI: | 10.4071/1551-4897-6.3.172 |
| Popis: | Electromagnetic cavity-resonance modes and parasitic coupling between excitation ports in parallel-plate solid planes of power-return and ground structures are investigated. Such structures are widely used in microwave multilayer packages (MCMs) and could be the source of considerable electromagnetic interference (EMI) or simultaneous switching noise (SSI). Effective methods should be applied for damping and elimination of the radiated fields, especially in small areas and volumes. The developed three-layered LTCC microwave package possesses two separate grounding planes on different levels, connected through multiple vias. The estimation of the electromagnetic field distribution and radiation is conducted by full-wave analysis of the proposed cavity-resonance models. The article also discusses the influence of the layout, vias grid distribution and material properties on the performance of the exemplary structure in the frequency band of interest, 10–30 GHz. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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