Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
| Autor: | Sadegh Khalili, Yaser Hadad, Bahgat Sammakia, Cong Hiep Hoang, Arvind Pattamatta, Bharath Ramakrishnan, Srikanth Rangarajan |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Materials science
business.industry 020209 energy Thermal resistance Liquid dielectric 02 engineering and technology Heat transfer coefficient Mechanics 021001 nanoscience & nanotechnology Computer Science Applications Electronic Optical and Magnetic Materials Coolant Mechanics of Materials Server Phase (matter) 0202 electrical engineering electronic engineering information engineering Data center Two-phase flow Electrical and Electronic Engineering 0210 nano-technology business |
| Zdroj: | Journal of Electronic Packaging. 143 |
| ISSN: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.4049928 |
| Popis: | High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling heat transfer technique is widely believed to address the heating problem posed by HPC racks. In this study, a novel liquid-cooled cold plate containing microchannel and jet impingement arrangement was characterized for its two-phase flow and thermal behavior. A sophisticated bench top setup involving a mock package was developed to carry out the experiments in a controlled fashion using a dielectric fluid Novec/HFE-7000. Two-phase flow boiling in cold plates which has a strong dependency on surface phenomena were carefully studied at various levels of inlet pressure, subcooling, flow rates, and heat flux levels to the mock package. A resistance network was invoked to determine the average heat transfer coefficient at various exit qualities estimated by the energy balance equation. While the results make it evident that, the high heat generating components can be kept at operable conditions using the two-phase cooling; a deeper insight at the outcomes could pave way for more energy efficient cold plate designs. The experiment was carried out with a large heated surface of 6.45 cm2 and maximum dissipated heat flux was around 63.6 W/cm2 corresponding to chip power of 410 W. Base temperature was kept below 75 °C and pressure drop did not exceed 21 kPa. |
| Databáze: | OpenAIRE |
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