| Autor: |
Roshan Makkar, K. Chalapathi, A.J. Verma |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
2008 IEEE International Conference on Semiconductor Electronics. |
| DOI: |
10.1109/smelec.2008.4770349 |
| Popis: |
SAMEER has recently setup an infrastructure to dasiapigtail and package laser diodespsila using optical epoxy and laser weld techniques. Few laser diodes have been packaged using dasiafiber alignment and laser weld system (FALWS)psila in butterfly and TO-CAN packages. The high power laser diode packaging involves good thermal management and post-weld shift challenges, and it is being experimentally verified with theoretical simulation. The laser diode packaging followed by reliability test as per Telcordia standard is the current technical challenges ahead. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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